Product brief introduction
Series of ES-375 cleaning agent is composed of ES-375A, ES-375B, A, B in 2:1 use, effect is extremely prominent, polycrystalline silicon, monocrystalline silicon photovoltaic industry for silicon wafer cleaning
Product features
●Economy : belong to concentrated products, low concentration dilution, the average low cleaning cost.
●efficiency: degreasing and cleaning effect is good, strong complexing ability, high cleanliness of cleaning characteristics.
●low foam: This product has low foam, suitable for immersion, ultrasonic and spray cleaning process.
Use
This product is only suitable for single crystal silicon, polycrystalline silicon oil, suspension, the oxide layer such as cleaning, not suitable for silicon wafer etching.
Method of use
●Suggest to add 3-6 kg concentrate ES-375 every 100 kilograms of working fluid (A:B=2:1), difficult to clean or oil heavy silicon can appropriately add cleaning agent , in order to ensure the cleaning effect, every class replacement.
●general every kilograms of silicon wafer cleaning agent can handle 125# monocrystalline silicon piece more than 2500 pieces, add according to the proportion of calculation, when polished wafer grinding paste and recovery of suspension cutting silicon should be appropriate to increase the dosage, course in insurance. It may be appropriate to reduce the amount of silicon wafer in condition.
●in order to guarantee the cleaning fluid cleanliness, recommend the use of deionized water allocation working fluid.
●silicon wafers in the cleaning process, as far as possible to reduce the exposed time in the air, to prevent the generation of flowers.
●according to the following suggestions for cleaning process
The first groove silicon water / citric acid ( lactic acid ) pre-washing
Second tank water
Third slot ES-375
Fourth slot ES-375
Fifth tank water ( behind the general 3-4 tank water rinse )
Matters needing attention
●line cut crystal bar can't touch water, if not timely cleaning, first kept in suspension or cleaning agents ( total Department of immersion ).
●line cut crystal bar once on cleaning, must be treated immediately. But do not let the wafer in the whole cleaning process natural drying.
●degumming must maintain silicon wetting, not natural drying.
●each cleaning cycle is complete ( such as shift change ), water tank five or six, seven, completely replaced the eight-slot.
●to ensure the cleanliness of the silicon wafer cleaning, spray before degumming flushing time best ●When in use should be detected per 4 hours , if the alkalinity decreased or cleaning is not clean and timely to add this agent, to ensure the working fluid effect.
Package specification
25KG/ barrel